Investigation of interfaces with analytical tools

IEEE Transactions on Device and Materials Reliability

Volumn 3, Issue 4, 2003, Pages 179-183

  Dias, Rajen ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; CRACKS; DELAMINATION; DIES; ELECTRONICS PACKAGING; INFRARED IMAGING; LASER APPLICATIONS; METALLIZING; TRANSISTORS;

ADHESION STRENGTH; LASER SPALLATION; THERMAL INTERFACE MATERIALS;

INTERFACES (MATERIALS);

EID: 3042848834     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.821668     Document Type: Article

References (7)

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6. V. Gupta et al., "Measurement of interfacial adhesion and its degradation in multi-layer packages, devices and blanket films using the laser spallation techniques," in Proc. 26th Symp. Testing and Failure Analysis, Bellevue, WA, Nov. 2000.
7. M. Miller and M. Mello, "Laser spallation adhesion metrology for electronic packaging development," in Proc. 52nd ECTC, 2002, pp. 192-198.