Size effect on the bending and tensile strength of micromachined polysilicon films for mems

Acta Mechanica Solida Sinica

Volumn 17, Issue 3, 2004, Pages 203-208

  Ding, Jianning ^a   Yang, Jichang ^a   Wen, Shizhu ^b  

^a JIANGSU UNIVERSITY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Bending strength; Polysilicon; Strain analysis; Tensile strength

Indexed keywords

BENDING STRENGTH; CANTILEVER BEAMS; DURABILITY; ELASTIC MODULI; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROSTRUCTURE; PLASTIC FILMS; STATISTICAL METHODS; STRAIN; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS; WEIBULL DISTRIBUTION;

NANOINDENTORS; POLYSILICON BEAMS; STANDARD DEVIATION; STRAIN ANALYSIS;

POLYSILICON;

EID: 10044277069     PISSN: 08949166     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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