Lead-free solder joint evaluation

SMT Surface Mount Technology Magazine

Volumn 12, Issue 3, 1998, Pages 84-88

  Romm, Douglas W ^a   Abbott, Donald C ^b  

^a TEXAS INSTRUMENTS   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003055550     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (3)

1. D.W. Romm, Palliadium Lead Finish User's Manual, 1994.
2. Howard Mario, Soldering, p. 254-57, 1994.
3. D.W. Romm and N. McLellan, "Evaluation of Water-soluble and No-clean Solder Pastes with Sn/Pb and Palladium-plated IC Devices," SMT Magazine, January 1993.