SCOPUS 정보 검색 플랫폼

Volumn 24, Issue 3, 2001, Pages 534-535

Editorial

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENVIRONMENTAL IMPACT; LEAD; SOLDERING;

ELECTRONIC PRODUCTS; ELECTRONICS MANUFACTURE; LEAD FREE MANUFACTURING;

ELECTRONICS INDUSTRY;

EID: 0035439741 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: None Document Type: Editorial

Times cited : (2)

References (3)

1
- 0034954270
- Examining the environmental impact of lead-free soldering alternatives
- Jan.
- (2001) IEEE Trans. Electron. Packag. Manufact. , vol.24 , pp. 4-9
- Turbini, L.¹ Munie, G.² Bernier, D.³ Gamalski, J.⁴ Bergman, D.⁵

2
- 0003050130
- Challenges and Efforts Toward Commercialization of Lead-Free Solder: Road Map 2000 for Commercialization of Lead-Free Solder, Version 1.3. Tech. Rep., Japan Electronic Industry Development Association

3
- 0031176798
- In-situ measurements of surface mount IC package deformations during reflow soldering
- July
- IEEE Trans. Comp., Packag., Manufact. Technol. C , vol.20 , pp. 207-212
- Pecht, M.G.¹ Govind, A.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.