Nanoindentation and tensile behavior of copper films

Materials Research Society Symposium - Proceedings

Volumn 778, Issue , 2003, Pages 93-98

  Read, D ^a   Geiss, R ^a   Ramsey, J ^b   Scherban, T ^c   Xu, G ^c   Blaine, J ^c   Miner, B ^c   Emery, R D ^c  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b REED COLLEGE   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DYNAMIC LOADS; ELECTROPLATING; GRAIN SIZE AND SHAPE; MECHANICAL VARIABLES MEASUREMENT; METALLIC FILMS; NANOSTRUCTURED MATERIALS; RESIDUAL STRESSES; TENSILE TESTING; YIELD STRESS;

FREE STANDING FILMS; HALL-PETCH TREND; MICROTENSILE TESTING; NANOINDENTATION;

COPPER;

EID: 0347568640     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-778-u4.3     Document Type: Conference Paper

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