Dielectric bottom anti-reflective coatings for copper dual damascene interconnects

Microelectronic Engineering

Volumn 71, Issue 2, 2004, Pages 125-132

  Kumar, R ^a,b   Wong, T K S ^b   Singh, N ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Antireflective coatings; BARC; Dual damascene; Lithography; Low

Indexed keywords

COMPUTER SIMULATION; COPPER; DIELECTRIC PROPERTIES; ETCHING; LIGHT REFLECTION; METALLIZING; OPTICAL INTERCONNECTS; PHOTOLITHOGRAPHY; REFRACTIVE INDEX; SILICON CARBIDE; SUBSTRATES; THICKNESS MEASUREMENT;

BOTTOM ANTIREFLECTIVE COATINGS (BARC); DUAL DAMASCENE;

ANTIREFLECTION COATINGS;

EID: 0346970922     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2003.10.001     Document Type: Article

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