Flip chip overview

Proceedings of the IEEE Multi-Chip Module Conference

Volumn , Issue , 1996, Pages 28-33

  Magill, Paul A ^a   Deane, Philip A ^a   Daniel Mis, J ^a   Rinne, Glenn A ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; COSTS; DIELECTRIC MATERIALS; ELECTROPLATING; FABRICATION; INTEGRATED CIRCUIT TESTING; MAINTENANCE; MASKS; METALLURGY; QUALITY ASSURANCE; RELIABILITY; TECHNOLOGY;

BUMPING PROCESSES; FLIP CHIP TECHNOLOGY;

MULTICHIP MODULES;

EID: 0029771317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)