Influence of shear height on shear strength of tin-lead solder ball bonding

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 2130-2136

  Nakamori, Takashi ^a   Ikeda, Mayumi ^a   Noguchi, Kunihiro ^a   Shimizu, Isao ^a   Ohno, Yasuhide ^a  

^a NIPPON STEEL CORPORATION   (Japan)

Author keywords

Cooling rate; Crack generation energy; Crack progress energy; Intermetallic compound; Reaction layer; Shear strength; Tin lead silver ball

Indexed keywords

COOLING; CRACK PROPAGATION; INTERMETALLICS; SHEAR STRENGTH; TIN ALLOYS;

SOLDER BALLS;

SOLDERING ALLOYS;

EID: 0036698817     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.2130     Document Type: Article

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