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Volumn 5, Issue 2, 2003, Pages 185-193

Thermally Enhanced Edge Registration for Aligning Diffusion-Bonded Laminae

Author keywords

Diffusion Bonding; Highly Parallel Microsystems; Microlamination; Registration

Indexed keywords

ALIGNMENT; DIFFUSION; GRAPHITE; HEAT EXCHANGERS; MASS TRANSFER; THERMAL EXPANSION;

EID: 0346750545     PISSN: 15266125     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1526-6125(03)70053-X     Document Type: Article
Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.