Self-aligned positioning of microoptical components by precision prismatic grooves impressed into metals

Journal of Microelectromechanical Systems

Volumn 8, Issue 1, 1999, Pages 58-64

  Rode, Manfred ^a   Hillerich, Bernd ^b,c  

^a DAIMLER AG   (Germany)

^b Fraunhofer Institut fur Festkorpertechnologie   (Germany)

^c IEEE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; MICROOPTICS; OPTICAL DEVICES; SUBSTRATES;

PRECISION PRISMATIC GROOVES; SELF-ALIGNED POSITIONING;

MICROELECTROMECHANICAL DEVICES;

EID: 0033100850     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.749403     Document Type: Article

References (15)

1. D. B. Lee, "Anisotropic etching of silicon," J. Appl. Phys., vol. 40, pp. 4569-4574, 1969.
2. K. E. Petersen, "Silicon as a mechanical material," Proc. IEEE, vol. 70, pp. 420-457, 1982.
3. C. M. Schroeder, "Accurate silicon spacer chips for an optical-fiber cable connector," Bell Syst. Tech. J., vol. 75, pp. 91-97, 1978.
4. B. Hillerich and A. Geyer, "Self-aligned flat-pack fiber-photodiode coupling," Electron. Lett., vol. 24, pp. 918-919, 1988.
5. K. A. Shaw et al., "SCREAM I: A single mask single-crystal silicon, reactive ion etching process for microelectromechanical structures," Sensors and Actuators A, vol. 40, pp. 63-70, 1994.
6. E. Klaasen et al., "Silicon fusion bonding and deep reactive ion etching: A new technology for microstructures," in Proc. Transducers'95, Eurosensors IX, vol. 1, pp. 556-559.
7. E. W. Becker et al., "Fabrication of microstructures with high aspect ratio and great structural height by synchrotron radiation lithography, galvanoforming, and plastic moulding," Microelectron. Eng., vol. 4, pp. 35-41, 1986.
8. W. Ehrfeld et al., "Microstructures with high aspect ratio and great structural height using synchrotron radiation lithography, galvanoforming, and plastic moulding," J. Vac. Sci. Technol., vol. B6, pp. 178-183, 1988.
9. R. A. Higgins, Engineering Metallurgy. London: Arnold, pp. 124-133, 1993.
10. H. Hoischen, "Loading limit and shape accuracy of dies with cold embossing," Research Report of NRW Country no. 1625, Westdeutscher Verlag, Duesseldorf, Cologne, 1966 (in German).
11. H. Hubert, "Influence of die geometry on shaping resistance and shape accuracy with cold embossing," Research Rep. NRW Country no. 2254, Westdeutscher Verlag, Duesseldorf, Cologne, 1972 (in German).
12. G. E. Dieter, Mechanical Metallurgy. New York: McGraw-Hill, ch. 15, 1988.
13. M. Rode and E. Weidel, "Compact and rugged all-fiber coupler for wavelength division multiplexing," Electron. Lett., vol. 18, no. 21, pp. 898-900, 1982.
14. B. Hillerich, M. Rode, and H. Gottsmann, "Single-mode fiber WDM unit for duplex subscriber link using a substrate with embossed alignment grooves," IEEE/OSA J. Lightwave Technol., vol. 7, no. 11, pp. 1654-1660, 1989.
15. L. Staudigel and E. Weidel, "Fixing technique for single-mode devices with small displacements," in Tech. Dig. Optical Fiber Communication Conf. OFC'87, Reno, NV, 1987, p. 115.