Angular alignment for wafer bonding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2879, Issue , 1996, Pages 291-297

  Chou, Yuan Fang ^a   Hsieh, Ming Hsun ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

MISALIGNMENT; SILICON WAFER BONDING; WET ETCHING;

ALIGNMENT; ANGLE MEASUREMENT; BONDING; ETCHING; FABRICATION; MASKS; MICROELECTRONICS; MICROSTRUCTURE; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE;

MICROELECTROMECHANICAL DEVICES;

EID: 0030413138     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)