Thermal analysis of GaAs power monolithic microwave IC's mounted with epoxy attachment

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 2, 1997, Pages 220-224

  Nishihori, Kazuya ^a   Ishida, Kenji ^a   Kitaura, Yoshiaki ^a   Uchitomi, Naotaka ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Attachment; Chip thickness; Epoxy; GaAs; Junction temperature; MMIC; Power FET; Solder; Thermal resistance; Uniplanar coplanar waveguide

Indexed keywords

COMPUTER SIMULATION; COST EFFECTIVENESS; EPOXY RESINS; HEAT RESISTANCE; MESFET DEVICES; SCHOTTKY BARRIER DIODES; SEMICONDUCTING GALLIUM ARSENIDE; THERMAL CONDUCTIVITY OF SOLIDS; THERMOANALYSIS;

JUNCTION TEMPERATURE; UNIPLANAR COPLANAR WAVEGUIDE;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0031163627     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.588577     Document Type: Article

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