Thermal modeling of power gallium arsenide microwave integrated circuits

IEEE Transactions on Electron Devices

Volumn 40, Issue 5, 1993, Pages 867-877

  Webb, Paul W ^a  

^a UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ENERGY GAP; MESFET DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES; THERMAL CONDUCTIVITY;

GALLIUG ARSENIDE MICROWVAE INTEGRATED CIRCUITS; GALLIUM ARSENIDE SUBSTRATES;

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0027591164     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/16.210192     Document Type: Article

References (14)

1. X. Gui, P. W. Webb, and G. Gao, “Use of the three-dimensional TLM method in the thermal simulation and design of semiconductor devices,” IEEE Trans. Electron Devices, vol. 39, no. 6, pp. 1295–1301, June 1992.
2. G. Gao, M. Wang, X. Gui, and H. Morkoç, “Thermal design studies of high power heterojunction bipolar transistors,” IEEE Trans. Elect ron Devices, vol. 36, no. 5, May, 1989.
3. M. Fan, A. Christou, and M. Pecht, “Two-dimensional thermal modeling of power monolithic microwave integrated circuits,” IEEE Trans. Electron Devices, vol. 39, no. 5, pp. 1075–1079, May 1992.
4. J. Dell, T. S. Kalkur, Z. Meglicki, A. G. Nassibian, and H. L. Hartnagel, “Some new concepts of heat-flow spreading in GaAs FET structures,” Int. J. Electron., vol. 57, no. 1. pp. 155–160, 1984.
5. H. Cooke, “Microwave field effects transistors,” Microwave J., vol. 21, no. 4, pp. 43–48, 1978.
6. H. Cooke, “Precise technique finds FET thermal resistance,” Microwave, RF, pp. 85–87, Aug. 1986.
7. H. Fukui, “Thermal resistance of GaAs field effect transistors,” in IEDM Tech. Dig. (Washington, DC), 1980, pp. 118–121.
8. P. W. Webb and I. A. D. Russell, “Thermal resistance of gallium arsenide field effect transistors,” Proc. Inst. Elec. Eng., vol. 136, pt. G, no. 5, pp. 229–234, Oct. 1989.
9. P. W. Webb and I. A. D. Russell, “Thermal simulation of transients in microwave devices,” Proc. Inst. Elec. Eng., vol. 138, pt. G, no. 3, pp. 329–334, Oct. 1989.
10. P. W. Webb, “Transmission line matrix modelling applied to thermal diffusion problems,” in IEE Coll. on Transmission Line Matrix Modelling, IEE Dig. No. 1991/157, Oct. 1991, pp. 4/1-4/5.
11. P. W. Webb, “Measurement of thermal resistance using electrical methods,” Proc. Inst. Elec. Eng., vol. 134, pt. 1, no. 2, Apr. 1987.
12. J. P. Holman, Heat Transfer. New York: McGraw-Hill, ISBN 0-07-066336-X.
13. J. C. Brice, “Properties of Gallium Arsenide,” EMIS Data Reviews Ser. No. 2, London 1NSPEC ISBN 0-85296-3238, 1986.
14. D. J. Dean, “Thermal design of electronic circuit boards and packages,” Electrochemical Publications Ltd., 1985, p. 143, or in Proc. Int. Conf., Brighton, UK, 1971, p. 315.