Thermal analysis and measurement of plastic packaged GaAs devices

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1996, Pages 89-96

  Chien, David H ^a   Lee, Chin C ^a   Rachlin, Michael ^a   Peake, Andy ^a   Kole, Thomas ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MODELS; SILICON ON INSULATOR TECHNOLOGY; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT; THERMOANALYSIS; THREE DIMENSIONAL;

HEAT SOURCES; LIQUID CRYSTAL MICROTHERMOGRAPHY; SMALL OUTLINE INTEGRATED CIRCUIT PLASTIC PACKAGE; UNIT THERMAL PROFILE;

ELECTRONICS PACKAGING;

EID: 0029713211     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)