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Volumn 764, Issue , 2003, Pages 135-140

TEM Studies and Contact Resistance of Au/Ni/Ti/Ta/n-GaN Ohmic Contacts

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL BONDS; DIFFUSION; ELECTRON ENERGY LOSS SPECTROSCOPY; ENERGY DISPERSIVE SPECTROSCOPY; HIGH RESOLUTION ELECTRON MICROSCOPY; INTERFACES (MATERIALS); METALLORGANIC CHEMICAL VAPOR DEPOSITION; MICROSTRUCTURE; OHMIC CONTACTS; STRUCTURE (COMPOSITION); THERMODYNAMIC STABILITY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 0345359258     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-764-c3.17     Document Type: Conference Paper
Times cited : (3)

References (13)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.