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Volumn 764, Issue , 2003, Pages 135-140
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TEM Studies and Contact Resistance of Au/Ni/Ti/Ta/n-GaN Ohmic Contacts
a a b b |
Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
CHEMICAL BONDS;
DIFFUSION;
ELECTRON ENERGY LOSS SPECTROSCOPY;
ENERGY DISPERSIVE SPECTROSCOPY;
HIGH RESOLUTION ELECTRON MICROSCOPY;
INTERFACES (MATERIALS);
METALLORGANIC CHEMICAL VAPOR DEPOSITION;
MICROSTRUCTURE;
OHMIC CONTACTS;
STRUCTURE (COMPOSITION);
THERMODYNAMIC STABILITY;
TRANSMISSION ELECTRON MICROSCOPY;
BUFFER LAYERS;
CONTACT RESISTANCE;
CONTACT SURFACES;
GALLIUM NITRIDE;
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EID: 0345359258
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-764-c3.17 Document Type: Conference Paper |
Times cited : (3)
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References (13)
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