Temperature Profiling with Highest Spatial and Temperature Resolution by Means of Scanning Thermal Microscopy (SThM)

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1997-October, Issue , 1997, Pages 51-56

  Fiege, Gero B M ^a   Cramer, R M ^a   Balk, L ^a   Reineke, F ^b  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b Topo Metrix Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

IMAGE RESOLUTION; PROBES; TEMPERATURE MEASUREMENT;

FEATURE SIZES; HIGH SPATIAL RESOLUTION; MEASUREMENT TECHNIQUES; MILLIKELVIN TEMPERATURES; SCANNING THERMAL MICROSCOPY; SINGLE STRUCTURE; SMALL FEATURES; SPATIAL RESOLUTION; TEMPERATURE PROFILING; TEMPERATURE RESOLUTION;

TEMPERATURE DISTRIBUTION;

EID: 0344870370     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1997p0051     Document Type: Conference Paper

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