A practical system for hot spot detection using Fluorescent Microthermal Imaging

Microelectronics Reliability

Volumn 36, Issue 11-12 SPEC. ISS., 1996, Pages 1811-1814

  Glacet, J Y ^a   Berne, S ^b  

^a MOTOROLA INC   (United States)

^b UNIVERSITÉ DE TOULOUSE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATIC TESTING; CHARGE COUPLED DEVICES; COMPUTER SOFTWARE; DATA ACQUISITION; FAILURE ANALYSIS; FLUORESCENCE; IMAGE PROCESSING; INFRARED IMAGING; OPTICAL MICROSCOPY; ULTRAVIOLET DEVICES; IMAGING TECHNIQUES; ULTRAVIOLET RADIATION;

FLUORESCENT MICROTHERMAL IMAGING (FMI) TECHNIQUE; HOT SPOT LOCALIZATION; FLUORESCENT MICROTHERMAL IMAGING; PROBE STATION;

SEMICONDUCTOR DEVICE TESTING;

EID: 0030274019     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00203-x     Document Type: Article

References (4)

1. Daniel L. Barton, International Symposium for Testing and Failure Analysis 1994, pp. 87-95.
2. Steve Leon, Motorola Internal Publication.
3. V. J. Bruce, International Symposium for Testing and Failure Analysis 1994, pp. 73-80.
4. P. Tangyunyong and D. L. Barton, International Symposium for Testing and Failure Analysis 1995, pp. 79-84.