Deep X-ray mask with integrated actuator for 3D microfabrication

Sensors and Actuators, A: Physical

Volumn 108, Issue 1-3, 2003, Pages 121-127

  Lee, Kwang Cheol ^a   Lee, Seung S ^b  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

3D microfabrication; Comb drive actuator; Deep X ray lithography; Deep X ray mask; Integrated microactuator; LIGA

Indexed keywords

ELECTRODES; ELECTROPLATING; MICROACTUATORS; MICROMACHINING; MICROSTRUCTURE; POLYMETHYL METHACRYLATES; REACTIVE ION ETCHING; SILICON ON INSULATOR TECHNOLOGY; X RAY LITHOGRAPHY; X RAYS;

COMB DRIVE ACTUATORS; X-RAY MASKS;

MASKS;

EID: 0344514649     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(03)00272-3     Document Type: Conference Paper

References (13)

1. H. Guckel, High-aspect-ratio micromachining via deep X-ray lithography, Proc. IEEE 86 (1998) 1586-1593.
2. T.R. Christenson, D.T. Schmale, A batch wafer scale LIGA assembly and packaging technique via diffusion bonding, in: Technical Digest of the 12th IEEE International Conference on Microelectromechanical Systems (MEMS'99), Orlando, FL, USA, January 17-21, 1999, pp. 476-481.
3. L.-W. Pan, L. Lin, Batch transfer of LIGA microstructures by selective electroplating and bonding, J. Microelectromech. Syst. 10 (2001) 25-32.
4. D. Maas, B. Büstgens, J. Fahrenberg, W. Keller, P. Ruther, W.K. Schomburg, D. Seidel, Fabrication of microcomponents using adhesive bonding techniques, in: Technical Digest of the Ninth IEEE International Conference on Microelectromechanical Systems (MEMS'96), San Diego, CA, USA, February 11-15, 1996, pp. 331-336.
5. V. White, C. Herdey, D.D. Denton, J. Song, X-ray fabrication of nonorthogonal structures using "surface" masks, J. Vac. Sci. Technol. B 15 (1997) 2514-2516.
6. W. Ehrfeld, A. Schmidt, Recent developments in deep X-ray lithography, J. Vac. Sci. Technol. B 16 (1998) 3526-3534.
7. A.D. Feinerman, R.E. Lajos, V. White, D.D. Denton, X-ray lathe: an X-ray lithographic exposure tool for nonplanar objects, J. Microelectromech. Syst. 5 (1996) 250-255.
8. T. Katoh, N. Nishi, M. Fukugawa, H. Ueno, S. Sugiyama, Direct writing for three-dimensional microfabrication using synchrotron radiation etching, Sens. Actuators A 89 (2001) 10-15.
9. S. Sugiyama, H. Ueno, Novel shaped microstructures processed by deep X-ray lithography, in: Technical Digest of the 2001 International Conference on Solid State Sensors and Actuator (Transducers'01), Munich, Germany, June 10-14, 2001, pp. 1574-1577.
10. 2DXRL), in: Technical Digest of the 14th IEEE International Conference on Microelectromechanical Systems (MEMS 2001), Interlaken, Switzerland, January 21-25, 2001, pp. 94-97.
11. 2DXRL) with multiple stages, in: Technical Digest of the 15th IEEE International Conference on Microelectromechanical Systems (MEMS 2002), Las Vegas, NV, USA, January 20-24, 2002, pp. 180-183.
12. Y. Cheng, N.-Y. Kuo, C.H. Su, Dose distribution of synchrotron X-ray penetrating materials of low atomic numbers, Rev. Sci, Instrum. 68 (1997) 180-183.
13. H. Winick, in: H. Winick, S. Doniach (Eds.), Synchrotron Radiation Research, Plenum Press, New York, 1980, Chapter 2, pp. 11-25.