Fabrication of microcomponents using adhesive bonding techniques

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1996, Pages 331-336

  Maas, D ^a   Buestgens, B ^a   Fahrenberg, J ^a   Keller, W ^a   Ruther, P ^a   Schomburg, W K ^a   Seidel, D ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BONDING; COMPONENTS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; PERFORMANCE; PUMPS; QUALITY CONTROL; RELIABILITY; VALVES (MECHANICAL);

ADHESIVE BONDING; ECONOMIC VIABILITY; MICROCOMPONENTS; MICROCOMPONENTS INTERCONNECTION; MICROPUMPS; MICROSYSTEMS TECHNOLOGY; MICROVALUES;

MICROELECTRONIC PROCESSING;

EID: 0029754595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)