Batch transfer of LIGA microstructures by selective electroplating and bonding

Journal of Microelectromechanical Systems

Volumn 10, Issue 1, 2001, Pages 25-32

  Pan, Li Wei ^a   Lin, Liwei ^b  

^a UNIVERSITY OF MICHIGAN   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Bonding; Electroplating; Flip chip; Lithographie Galvanoformung and Abformung microgripper

Indexed keywords

BINDING ENERGY; CURRENT DENSITY; ELECTROPLATING; MICROSTRUCTURE; SUBSTRATES;

BATCH TRANSFER PROCESS; MICROGRIPPERS; SELECTIVE ELECTROPLATING;

FLIP CHIP DEVICES;

EID: 0035279362     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.911088     Document Type: Article

References (23)

1. Fabrication technology for an integrated surface-micromachined sensor
2. Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry
3. Integrating SCREAM micromachined devices with inregraed circuits
4. Characterization of the embedded micromechanical device approach to the monolithic integration of mems with cmos
5. Batch transfer of microstructures using flip-chip solder bump bonding
6. Development of an innovative flip-chip bonding technique using micromachined conductive polymer bumps
7. A batch wafer scale LIGA assembly and packaging technique via diffusion bonding
8. Self-aligned machining and assembly of high aspect ratio microparts into silicon
9. Molding process with high alignment precision for the LIGA technology
10. Technology for movable microstructures - Transfer of laboratory process to industrial production
11. Fabrication of micromotors using LIGA process
12. Fabrication of a 3D differential-capacitive acceleration sensor by UV-LIGA
13. Electrothermal actuators fabricated in four-level planarized surface micromachined poly-crystalline silicon
14. A flip-chip LIGA assembly technique via electroplating
15. Investigations of the grain growth behavior of nanocrystalline nickel
16. Structures of thin nickel electrodeposits epitaxially grown on cube-textured copper substrates