Excimer laser lift-off for packaging and integration of GaN-based light-emitting devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4977, Issue , 2003, Pages 587-601

  Sands, Timothy D ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; ELECTRIC RESISTANCE; EXCIMER LASERS; HEAT RESISTANCE; HETEROJUNCTIONS; INTEGRATION; INTERFACES (MATERIALS); LIGHT EMITTING DIODES; MICROELECTROMECHANICAL DEVICES; OPTICAL DESIGN; PULSED LASER APPLICATIONS; SEMICONDUCTING GALLIUM COMPOUNDS;

BURIED INTERFACE; ELECTRIC SERIES RESISTANCE; EXCIMER LASER LIFT-OFF; FUNCTIONALLY ENHANCED MICROSYSTEMS; HEAT EXTRACTION; INTEGRATED FLUORESCENCE DETECTION MICROSYSTEM; LOW TEMPERATURE BONDING METHODS; SAPPHIRE DICING STEP; THERMAL BUDGET;

ELECTRONICS PACKAGING;

EID: 0344430146     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.483854     Document Type: Conference Paper

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