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Volumn Part F133492, Issue , 1998, Pages 1361-1371

Characterization of underfill materials for functional solder bumped flip chips on board applications

Author keywords

[No Author keywords available]

Indexed keywords

GLASS TRANSITION; MOISTURE; MOISTURE DETERMINATION; NETWORK COMPONENTS; SHEAR FLOW; SUBSTRATES; CURING; ENCAPSULATION; SHEAR STRENGTH; SOLDERING; THERMAL EXPANSION;

EID: 0031619625     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678921     Document Type: Conference Paper
Times cited : (3)

References (23)
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    • November
    • Han, S., K. K. Wang, "Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips", IEEE Transactions on CPMT, Part B, Advanced Packaging, Vol. 20, No. 4, November 1997, pp. 424-433.
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    • Han, S.1    Wang, K.K.2
  • 9
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    • November
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    • (1997) IEEE Transactions on CPMT, Part B, Advanced Packaging , vol.20 , Issue.4 , pp. 434-442
    • Han, S.1    Wang, K.K.2
  • 10
    • 0029699623 scopus 로고    scopus 로고
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    • May
    • Shi, D. M., J. W. Carbin, "Advances in Flip-Chip Underfill Flow and Cure Rates and Their Enhancement of Manufacturing Processes and Component Reliability", Proceedings of IEEE Electronic Components & Technology Conference, May 1996, pp. 1025-1031.
    • (1996) Proceedings of IEEE Electronic Components & Technology Conference , pp. 1025-1031
    • Shi, D.M.1    Carbin, J.W.2
  • 16
    • 0029277388 scopus 로고
    • Design and procurement of eutectic sn/pb solder-bumped flip chip test die and organic substrates
    • March
    • Lau, J. H., M. Heydinger, J. Glazer, D. Uno, "Design and Procurement of Eutectic Sn/Pb Solder-Bumped Flip Chip Test Die and Organic Substrates", Circuit World, Vol. 21, March 1995, pp. 20-24.
    • (1995) Circuit World , vol.21 , pp. 20-24
    • Lau, J.H.1    Heydinger, M.2    Glazer, J.3    Uno, D.4
  • 17
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    • Characterization and evaluation of the underfill encapsulants for flip chip assembly
    • March
    • Wun, W., J. H. Lau, "Characterization and Evaluation of the Underfill Encapsulants for Flip Chip Assembly", Circuit World, Vol. 21, March 1995, pp. 25-32.
    • (1995) Circuit World , vol.21 , pp. 25-32
    • Wun, W.1    Lau, J.H.2
  • 18
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    • Low cost solder bumped Flip Chip MCM-L Demonstration
    • July
    • Kelly, M., J. H. Lau, "Low Cost Solder Bumped Flip Chip MCM-L Demonstration", Circuit World, Vol. 21, July 1995, pp. 14-17.
    • (1995) Circuit World , vol.21 , pp. 14-17
    • Kelly, M.1    Lau, J.H.2
  • 19
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    • Experimental and analytical studies of encapsulated flip chip solder bumps on surface laminar circuit boards
    • March
    • Lau, J. H., Krulevitch, T., Schar, W., Heydinger, M., Erasmus, S., Gleason, J., "Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards", Circuit World, Vol. 19, No. 3, March 1993, pp. 18-24.
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  • 20
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    • November
    • Lau, J. H., "Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, Vibration Conditions", IEEE Transcations on CPMT, Part B, Advanced Packaging, Vol. 19, No. 4, November 1996, pp. 728-735.
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  • 23
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    • Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device
    • to be published at
    • Lau, J. H., C. Chang, R. Chen, "Effects of Underfill Encapsulant on the Mechanical and Electrical Performance of a Functional Flip Chip Device", to be published at the Journal of Electronics Manufacturing, 1998.
    • (1998) The Journal of Electronics Manufacturing
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.