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1
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0004034857
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McGraw-Hill, New York, NY
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Lau, J. H., C. P. Wong, J. L. Prince, W. Nakayama, Electronic Packaging: Design, Materials, Process, Reliability, McGraw-Hill, New York, NY, 1998.
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(1998)
Electronic Packaging: Design, Materials, Process, Reliability
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Lau, J.H.1
Wong, C.P.2
Prince, J.L.3
Nakayama, W.4
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4
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0029228629
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Liquid encapsulant stress variations as measured with the atc04 assembly test chip
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May
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Sweet, J., D. Peterson, J. Emerson, R. Mitchell, "Liquid Encapsulant Stress Variations as Measured with the ATC04 Assembly Test Chip", Proceedings of IEEE Electronic Components ^Technology Conference, May 1995, pp. 300-304.
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(1995)
Proceedings of IEEE Electronic Components ^Technology Conference
, pp. 300-304
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Sweet, J.1
Peterson, D.2
Emerson, J.3
Mitchell, R.4
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5
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0030718912
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High performance no flow underfills for low-cost flip-chip applications
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May
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Wong, C. P., S. H. Shi, G. Jefferson, "High Performance No Flow Underfills for Low-Cost Flip-Chip Applications", Proceedings of IEEE Electronic Components & Technology Conference, May 1997, pp. 850-858.
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(1997)
Proceedings of IEEE Electronic Components & Technology Conference
, pp. 850-858
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Wong, C.P.1
Shi, S.H.2
Jefferson, G.3
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6
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0002876537
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Chip on board encapsulation
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edited by J. H. Lau Van Nostrand Reinhold, New York
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Wong, C. P., J. M. Segelken, C. N. Robinson, "Chip On Board Encapsulation", in Chip On Board Technologies for Multichip Modules, edited by J. H. Lau, Van Nostrand Reinhold, New York, 1994, pp. 470-503.
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(1994)
In Chip on Board Technologies for Multichip Modules
, pp. 470-503
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Wong, C.P.1
Segelken, J.M.2
Robinson, C.N.3
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7
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0029698873
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Materials and mechanics issues in flip-chip organic packaging
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May
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Wu, T. Y., Y. Tsukada, W. T. Chen, "Materials and Mechanics Issues in Flip-Chip Organic Packaging", Proceedings of IEEE Electronic Components & Technology Conference, May 1996, pp. 524-534.
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(1996)
Proceedings of IEEE Electronic Components & Technology Conference
, pp. 524-534
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Wu, T.Y.1
Tsukada, Y.2
Chen, W.T.3
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8
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0031276349
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Analysis of the flow of encapsulant during underfill encapsulation of flip-chips
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November
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Han, S., K. K. Wang, "Analysis of the Flow of Encapsulant During Underfill Encapsulation of Flip-Chips", IEEE Transactions on CPMT, Part B, Advanced Packaging, Vol. 20, No. 4, November 1997, pp. 424-433.
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(1997)
IEEE Transactions on CPMT, Part B, Advanced Packaging
, vol.20
, Issue.4
, pp. 424-433
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Han, S.1
Wang, K.K.2
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9
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0031268605
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Study on the pressurized underfill encapsulation of flip-chips
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November
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Han, S., K. K. Wang, "Study on the Pressurized Underfill Encapsulation of Flip-Chips", IEEE Transactions on CPMT, Part B, Advanced Packaging, Vol. 20, No. 4, November 1997, pp. 434-442.
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(1997)
IEEE Transactions on CPMT, Part B, Advanced Packaging
, vol.20
, Issue.4
, pp. 434-442
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Han, S.1
Wang, K.K.2
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10
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0029699623
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Advances in flip-chip underfill flow and cure rates and their enhancement of manufacturing processes and component reliability
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May
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Shi, D. M., J. W. Carbin, "Advances in Flip-Chip Underfill Flow and Cure Rates and Their Enhancement of Manufacturing Processes and Component Reliability", Proceedings of IEEE Electronic Components & Technology Conference, May 1996, pp. 1025-1031.
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(1996)
Proceedings of IEEE Electronic Components & Technology Conference
, pp. 1025-1031
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Shi, D.M.1
Carbin, J.W.2
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11
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0029218671
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Repairability of underfill encapsulated flip chip packages
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May
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Suryanarayana, D., J. Varcoe, J. Ellerson, "Repairability of Underfill Encapsulated Flip Chip Packages", Proceedings of IEEE Electronic Components & Technology Conference, May 1995, pp. 524-528.
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(1995)
Proceedings of IEEE Electronic Components & Technology Conference
, pp. 524-528
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Suryanarayana, D.1
Varcoe, J.2
Ellerson, J.3
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13
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0004093302
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McGraw-Hill, New York, NY
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Lau, J. H., Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY, 1997.
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(1997)
Solder Joint Reliability of BGA, CSP, Flip Chip, Fine Pitch SMT Assemblies
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Lau, J.H.1
Pao, Y.-H.2
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16
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0029277388
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Design and procurement of eutectic sn/pb solder-bumped flip chip test die and organic substrates
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March
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Lau, J. H., M. Heydinger, J. Glazer, D. Uno, "Design and Procurement of Eutectic Sn/Pb Solder-Bumped Flip Chip Test Die and Organic Substrates", Circuit World, Vol. 21, March 1995, pp. 20-24.
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(1995)
Circuit World
, vol.21
, pp. 20-24
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Lau, J.H.1
Heydinger, M.2
Glazer, J.3
Uno, D.4
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17
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0029275313
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Characterization and evaluation of the underfill encapsulants for flip chip assembly
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March
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Wun, W., J. H. Lau, "Characterization and Evaluation of the Underfill Encapsulants for Flip Chip Assembly", Circuit World, Vol. 21, March 1995, pp. 25-32.
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(1995)
Circuit World
, vol.21
, pp. 25-32
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Wun, W.1
Lau, J.H.2
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18
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0029346780
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Low cost solder bumped Flip Chip MCM-L Demonstration
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July
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Kelly, M., J. H. Lau, "Low Cost Solder Bumped Flip Chip MCM-L Demonstration", Circuit World, Vol. 21, July 1995, pp. 14-17.
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(1995)
Circuit World
, vol.21
, pp. 14-17
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Kelly, M.1
Lau, J.H.2
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19
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0027569172
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Experimental and analytical studies of encapsulated flip chip solder bumps on surface laminar circuit boards
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March
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Lau, J. H., Krulevitch, T., Schar, W., Heydinger, M., Erasmus, S., Gleason, J., "Experimental and Analytical Studies of Encapsulated Flip Chip Solder Bumps on Surface Laminar Circuit Boards", Circuit World, Vol. 19, No. 3, March 1993, pp. 18-24.
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(1993)
Circuit World
, vol.19
, Issue.3
, pp. 18-24
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Lau, J.H.1
Krulevitch, T.2
Schar, W.3
Heydinger, M.4
Erasmus, S.5
Gleason, J.6
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20
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0030291758
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Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, vibration conditions
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November
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Lau, J. H., "Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, Vibration Conditions", IEEE Transcations on CPMT, Part B, Advanced Packaging, Vol. 19, No. 4, November 1996, pp. 728-735.
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(1996)
IEEE Transcations on CPMT, Part B, Advanced Packaging
, vol.19
, Issue.4
, pp. 728-735
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Lau, J.H.1
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21
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0030165108
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Shock and vibration of solder bumped flip chip on organic coated copper boards
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June
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Lau, J. H., E. Schneider, T. Baker, "Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards", ASME Transactions, Journal of Electronic Packaging, June 1996, pp. 101-104.
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(1996)
ASME Transactions Journal of Electronic Packaging
, pp. 101-104
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Lau, J.H.1
Schneider T Baker, E.2
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22
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0001926866
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Flip chip assembly using the gold, gold-tin and nickel-gold metallurgy
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edited by J. H. Lau McGraw-Hill, New York
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Zakel, E., H. Reichl, "Flip Chip Assembly Using the Gold, Gold-Tin and Nickel-Gold Metallurgy", in Flip Chip Technologies, edited by J. H. Lau, McGraw-Hill, New York, 1996, pp. 415-490.
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(1996)
Flip Chip Technologies
, pp. 415-490
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Zakel, E.1
Reichl, H.2
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23
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85053886631
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Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device
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to be published at
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Lau, J. H., C. Chang, R. Chen, "Effects of Underfill Encapsulant on the Mechanical and Electrical Performance of a Functional Flip Chip Device", to be published at the Journal of Electronics Manufacturing, 1998.
-
(1998)
The Journal of Electronics Manufacturing
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Lau, J.H.1
Chang, C.2
Chen, R.3
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