Refined micro Moire system and its applications to chip scale and flip-chip packages

American Society of Mechanical Engineers, EEP

Volumn 24, Issue , 1998, Pages 59-64

  Zou, Daqing ^a   He, Xiaoyuan ^a   Lu, Minfu ^a   Liu, Sheng ^a   Guo, Yifan ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLOSED LOOP CONTROL SYSTEMS; DEFORMATION; FLIP CHIP DEVICES; INTERFEROMETRY; MICROPROCESSOR CHIPS; PHASE SHIFT; SOLDERING; STRAIN MEASUREMENT; THERMAL EFFECTS;

REFINED MICRO MOIRE INTERFEROMETRY;

ELECTRONICS PACKAGING;

EID: 0032319255     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)