Phase-shifting analysis in moiré interferometry and its applications in electronic packaging

Optical Engineering

Volumn 37, Issue 5, 1998, Pages 1410-1419

  He, Xiaoyuan ^a,c,d,e   Zou, Daqing ^a,f,g,h   Liu, Sheng ^a,i,j   Guo, Yifan ^b  

^a Wayne State University   (United States)

^b MOTOROLA INC   (United States)

^c NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^d SOUTHEAST UNIVERSITY   (China)

^e SOUTHWEST JIAOTONG UNIVERSITY   (China)

^f WAYNE STATE UNIVERSITY   (United States)

^g TSINGHUA UNIVERSITY   (China)

^h BEIHANG UNIVERSITY   (China)

ⁱ STANFORD UNIVERSITY   (United States)

^j NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

more..

Author keywords

Electronic packaging; Image processing; Interferometry; Micro moir ; Moir ; Phase shifting

Indexed keywords

EID: 0000771608     PISSN: 00913286     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.601657     Document Type: Article

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