Testing and constitutive modeling of thin polymer films and underfills by a 6-axis submicron tester

American Society of Mechanical Engineers, EEP

Volumn 22, Issue , 1997, Pages 105-112

  Qian, Zhengfang ^a   Lu, Minfu ^a   Wang, Jianjun ^a   Liu, Sheng ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT TESTING; NYLON POLYMERS; PLASTIC FILMS; POLYCARBONATES; THERMAL EFFECTS; THIN FILMS;

UNDERFILL HYSOL FP4526;

ELECTRONICS PACKAGING;

EID: 0031368186     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (25)