Heat dissipation and thermal enhancements for PQFP, BGA and flip chip

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 2163-2167

  Zhou, Tiao ^a   Hundt, Michael J ^a  

^a STMicroelectronics USA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0343409541     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)

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12. Zhou, T. and Hundt, M., 1996a, "Board and system level effects plastic package thermal performance", proceedings of 46th ECTC, pp. 911-917.
13. Zhou, T. and Hundt, M., 1996b, "PQFP thermal enhancements for steady state and transient applications", SGS-Thomson report
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