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Volumn , Issue , 1996, Pages 51-58
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Thermal evaluation of simulated finish and flatness conditions typical to MCM and MPU applications
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Author keywords
[No Author keywords available]
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Indexed keywords
INTERFACES (MATERIALS);
MATERIALS TESTING;
MICROPROCESSOR CHIPS;
MULTICHIP MODULES;
PRESSURE CONTROL;
PRESSURE EFFECTS;
SURFACE PROPERTIES;
TEMPERATURE;
THERMODYNAMIC PROPERTIES;
POWER LEVELS;
SURFACE FINISH;
SURFACE FLATNESS;
TEMPERATURE DIFFERENTIALS;
TEST FIXTURING;
THERMAL RESISTANCE;
ELECTRONICS PACKAGING;
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EID: 0029724707
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (2)
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