Analysis of thermally-enhanced SOIC packages

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1996, Pages 1-13

  Guenin, Bruce M ^a   Chowdhury, Asif ^a   Groover, Richard ^a   Derian, Edward J ^a  

^a Amkor Electronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; FINITE ELEMENT METHOD; HEAT LOSSES; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL TECHNIQUES; SEMICONDUCTOR JUNCTIONS; SHEET MOLDING COMPOUNDS; SURFACE MOUNT TECHNOLOGY; THERMAL EFFECTS; THERMODYNAMIC PROPERTIES;

CHIP ON LEAD PACKAGE; DUAL SIDED PACKAGE; EPOXY MOLDING COMPOUNDS; FUSED LEADS; HEAT SLUGS; PAD INNER LEAD TIP SPACING; SMALL OUTLINE INTEGRATED CIRCUIT PACKAGES; THERMAL RESISTANCE; THERMALLY ENHANCED MOLDING COMPOUND;

ELECTRONICS PACKAGING;

EID: 0029706480     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)