Thermal enhancements of ball grid arrays

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 2, Issue , 1996, Pages 702-711

  Hundt, Michael ^a   Saboui, Ali ^a   Exposito, Juan ^a   Motta, Valter ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; HEAT CONVECTION; HEAT LOSSES; HEAT SINKS; HEAT TRANSFER; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY; TEMPERATURE; THERMODYNAMICS;

AVAILABILITY OF AIRFLOW; BALL GRID ARRAYS; MAXIMUM ALLOWABLE CHIP TEMPERATURE; POWER DISSIPATION CAPABILITY; THERMAL ENHANCEMENTS;

ELECTRONICS PACKAGING;

EID: 0029705024     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)