Thermoelectric infrared imaging microsystems by commercial CMOS technology

European Solid-State Device Research Conference

Volumn , Issue , 1998, Pages 52-55

  Paul, O ^a   Schneeberger, N ^b   Munch, U ^b   Walti, M ^b   Schaufelbuhl, A ^b   Baltes, H ^b   Menolfi, C ^b   Huang, Q ^b   Doering, E ^c   Muller, K ^d   Loepfe, M ^d  

^a UNIVERSITY OF FREIBURG   (Germany)

^b ETH ZURICH   (Switzerland)

^c EM Microelectronic   (Switzerland)

^d Siemens Schweiz AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; INFRARED IMAGING; PIXELS; THERMOGRAPHY (IMAGING);

AMPLIFIER SYSTEMS; AU ELECTROPLATING; BULK SILICON MICROMACHINING; CMOS TECHNOLOGY; INTERNAL RESISTANCE; NOISE EQUIVALENT TEMPERATURE DIFFERENCE; ON CHIPS; RESPONSIVITY;

MICROSYSTEMS;

EID: 0348155301     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. R. A. Wood, "High-performance infrared thermal imaging with monolithic silicon focal planes operating at room temperature", Tech. Digest 1EDM 1993, IEEE, Washington DC, 1993, pp.175-178.
2. H. lerominek, M. Renaud, N. R. Swart, F. Picard, T. D. Pope, M. Levesque, M. Lehoux, G. Bilodeau, M. Pelletier, D. Audet, and P. Lambert, "Micromachined V02-based uncooled IR bolometric detector arrays with integrated CMOS readout electronics," Proc. SP1E, Vol. 2882, SPiIE, Austin TX, 1996, pp. 111-121.
3. A. D. Oliver, W. G. Baer, and K. D. Wise, "A Bulk-Micromachined 1024-Element Uncooled Infrared Imager", Transducers '95 Digest of Technical Papers, Vol. 2, Stockholm, 1995, pp. 636-639.
4. N. Schneeberger, O. Paul, and H. Baltes, "Optimization of CMOS Infrared Detector Microsystems", Proc. SPlE, Vol. 2882, SPIE, Austin TX, 1996, pp. 122-131.
5. U. Munch, D. Jaeggi, N. Schneeberger, A. Schaufelbuhl, O. Paul, H. Baltes, and J. Jaspers, "Industrial Fabrication Technology for CMOS Infrared Sensor Arrays", Transducers'97 Digest of Technical Papers, IEEE, Chicago, 1997, pp. 205-208.
6. C. Menolfi, Q. Huang, and N. Schneeberger, "A low noise thermoelectric infrared detector microsystem in a digital CMOS technology", Proc. ESSCIRC 96, Neuchiitel, 1996, pp. 128-131.
7. M. Wiilti, O. Paul, and H. Baltes, " Packaging of CMOS Infrared Detectors using Si-AI-Au Bonding", Proc. 1997 Symposium of the Electrochemical Society, Paris, 1998, in press.