Thermal stresses in microelectronics subassemblies: Quantitative characterization using photomechanics methods

Journal of Thermal Stresses

Volumn 26, Issue 6, 2003, Pages 583-613

  Han, Bongtae ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Far Infrared Fizeau Interferometry; Interconnections; Microelectronics Packaging; Microscopic Moir Interferometry; Moir Interferometry; Photomechanics Methods; Shadow Moir ; Twyman Green Interferometry

Indexed keywords

CERAMIC MATERIALS; INTERFEROMETRY; MECHANICAL VARIABLES MEASUREMENT; MICROELECTRONICS; MULTICHIP MODULES; PHOTOMECHANICS; PRINTED CIRCUIT BOARDS; THERMAL STRESS;

IN SITU DISPLACEMENT; MICROELECTRONICS PACKAGING; MICROELECTRONICS SUBASSEMBLIES; MULTICHIP CERAMIC BALL GRID ARRAY; PHOTOMECHANICS METHOD;

ELECTRONICS PACKAGING;

EID: 0242695728     PISSN: 01495739     EISSN: 1521074X     Source Type: Journal    
DOI: 10.1080/713855954     Document Type: Article

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