Measurement of thermal expansion coefficient of flexible substrate by moiré interferomentry

Experimental Techniques

Volumn 25, Issue 3, 2001, Pages 22-25

  Han, B ^a   Wu, Z ^a   Cho, S ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CURING; DIFFRACTION GRATINGS; INTERFEROMETRY; MICROELECTRONICS; SILICONES; SUBSTRATES; THERMAL EFFECTS;

FLEXIBLE SUBSTRATES; MOIRE INTERFEROMETRY;

THERMAL EXPANSION;

EID: 0035330392     PISSN: 07328818     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1747-1567.2001.tb00020.x     Document Type: Article

References (10)

1. Thermal-mechanical strain characterization for printed wiring boards
2. Determination of effective coefficient of thermal expansion of electronic packaging components: A wholefield approach
3. Moiré methods for engineering and science - Moiré interferometry and shadow moiré
4. Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation
5. Deformation mechanism of two-phase solder column interconnections under highly accelerated thermal cycling condition: An experimental study
6. Recent advancement of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronics devices
7. Uncertainty analysis
8. A practical multiplied moiréfringe technique