In-process board warpage measurement in a lab scale wave soldering oven

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 562-569

  Stiteler, Michael R ^b   Ume, I Charles ^a,b   Leutz, Brian ^b  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Automated system; Electronic packaging; Fringes; Online measurement; Out of plane displacement; Printed wiring board; Printed wiring board assembly; PWB; PWBA; Reflow solder; Reliability; Shadow moir ; Simulation; Solder joints; Warpage; Wave solder

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; PRINTED CIRCUIT MANUFACTURE; REAL TIME SYSTEMS; RELIABILITY; RESIDUAL STRESSES; SOLDERED JOINTS; SOLDERING; SURFACE MOUNT TECHNOLOGY; TEMPERATURE CONTROL;

AUTOMATED ON LINE WARPAGE MEASUREMENT SYSTEM; PRINTED WIRING BOARD ASSEMBLIES (PWBA); PRINTED WIRING BOARDS (PWB); SHADOW MOIRE TECHNIQUE;

PRINTED CIRCUIT BOARDS;

EID: 0030408751     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554938     Document Type: Article

References (9)

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