In situ evaluation of residual stresses in an organic die-attach adhesive

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 3, 1998, Pages 314-318

  Voloshin, A S ^a   Tsao, P H ^a   Pearson, R A ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CURING; EPOXY RESINS; EVALUATION; IMAGE PROCESSING; INTERFEROMETRY; ORGANIC COMPOUNDS; RESIDUAL STRESSES;

ORGANIC ADHESIVES;

ADHESIVES;

EID: 0032166506     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792639     Document Type: Article

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