RF flip-module ega package

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 2, 1999, Pages 111-115

  Yee, L Low ^a   Degani, Yinon ^a   Guinn, Keith V ^a   Dixon Dudderrar, T ^a   Gregus, Jeffrey A ^a   Frye, Robert C ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

Flip chip; Inductance; Modeling; Package; RF

Indexed keywords

COMPUTER AIDED NETWORK ANALYSIS; COMPUTER SIMULATION; ELECTRIC INDUCTORS; FLIP CHIP DEVICES; INDUCTANCE MEASUREMENT; SEMICONDUCTING SILICON; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THIN FILM CIRCUITS; TRANSCEIVERS; VARACTORS; VARIABLE FREQUENCY OSCILLATORS;

BALL GRID ARRAYS (BGA); FLIP-CHIP MOUNTED TRANSCEIVERS; SURFACE MOUNT VARACTORS;

ELECTRONICS PACKAGING;

EID: 0033319276     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.763180     Document Type: Article

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