Cost-effective solutions for high density interconnect and RF modules using low temperature cofired ceramic materials

Microwave Journal

Volumn 44, Issue 4, 2001, Pages 140-150

[No Author Info available]

Author keywords

[No Author keywords available]

Indexed keywords

LOW TEMPERATURE COFIRED CERAMICS (LTCC);

DIELECTRIC MATERIALS; DIGITAL SIGNAL PROCESSING; OPTICAL INTERCONNECTS; SINTERING; WIRELESS TELECOMMUNICATION SYSTEMS;

CERAMIC MATERIALS;

EID: 0035305219     PISSN: 01926225     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

1. W.A. Vitriol and J.I. Steinberg, "Development of a Low Temperature, Cofired Multilayer Ceramic Technology," International Journal of Microelectronics, 1983, pp. 593-598.
2. K.R. Mikeska and R.C. Mason, "Dimensional Control in Cofired Glass-ceramic Multilayers," Proceedings of the 6th SAMPE Electronics Conference, 1992, pp. 699-712.
3. K.R. Mikeska and R.H Jensen, "Pressure-assisted Sintering of Multilayer Packages," Ceramic Transactions 15, 1990, pp. 629-650.
4. Michael A. Skurski, et al., "Thick-film Technology Offers High Density Packaging," Microwaves and RF, February 1999.
5. Dan Amey, et al., "Ceramic Technology for Integrated Packaging for Wireless," Proceedings of the RFIC Symposium, Anaheim, CA, June 1999.
6. Daniel I. Amey and Samuel J. Horowitz, "Characterization of Low Loss LTCC Materials at 40 GHz," Proceedings of the International Symposium on Microelectronics, Chicago, 1999.
7. P.C. Donohue, et al., "A New Low Loss Lead Free LTCC System for Wireless and RF Applications," Proceedings of the International Conference on Multichip Modules and High Density Packaging, 1998, pp. 196-199.
8. www.bluetooth.com