Surface mount microwave package characterization technique

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 995-998

  Pham, A ^a   Chun, C ^a   Laskar, J ^a   Hutchison, Brian ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; MICROWAVE AMPLIFIERS; MODELS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PLASTICS APPLICATIONS; SURFACE MOUNT TECHNOLOGY; WAVEGUIDES;

COPLANAR WAVEGUIDE TO PACKAGE ADAPTERS (CPA); LINE REFLECT MATCH (LRM) CALIBRATIONS; SMALL SHRINK OUTLINE PACKAGES (SSOP); SURFACE MOUNT MICROWAVE PACKAGING;

ELECTRONICS PACKAGING;

EID: 0030654875     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)