Impact of thermal cycling on the evolution of grain, precipitate and dislocation structure in Al, 0.5% Cu, 1% Si thin films

Microelectronic Engineering

Volumn 70, Issue 2-4, 2003, Pages 447-454

  Kaouache, B ^a   Gergaud, P ^b   Thomas, O ^b   Bostrom, O ^b   Legros, M ^c  

^a UNIVERSITÉ PAUL VERLAINE METZ   (France)

^b AIX MARSEILLE UNIVERSITY   (France)

^c CEMES CNRS   (France)

Author keywords

Al film; In situ TEM; Plastic deformation; Thermal cycling

Indexed keywords

CRYSTAL MICROSTRUCTURE; DISLOCATIONS (CRYSTALS); PRECIPITATION (CHEMICAL); SILICON; STRUCTURE (COMPOSITION); THERMAL CYCLING;

DISLOCATION STRUCTURE;

THIN FILMS;

EID: 0142075262     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00385-X     Document Type: Conference Paper

References (30)

1. Ames I., d'Heurle F. IBM J. Res. Dev. 14:1970;461.
2. Leusink G.J., Lokker J.P., van den Homberg M.J.C., Jongste J.F., Oosterlaken T.G.M., Janssen G.C.A.M., Radelaar S. Appl. Surf. Sci. 91:1995;215.
3. Flinn P.A., Gardner D.S., Nix W.D. IEEE Trans. Electron. Dev. 34:1987;689.
4. Nix W.D. Metall. Trans. A. 20A:1989;2217.
5. Besser P.R., Brennan S., Bravman J.C. J. Mater. Res. 9:1994;13.
6. Kraft O., Hommel M., Arzt E. Mater. Sci. Eng. A. 288:2000;209.
7. Choi Y., Suresh S. Acta Mater. 50:2002;1881.
8. Josell D., Weihs T.P., Gao H. MRS Bull. 27:2002;39.
9. Frost H.J., Ashby M.F. Deformation Mechanisms Maps. 1982;Pergamon, Oxford.
10. Thouless M.D., Gupta J., Harper J.M.E. J. Mater. Res. 8:1993;1845.
11. Thouless M.D. Annu. Rev. Mater. Sci. 25:1995;69.
12. Koike J., Utsunomiya S., Shimoyama Y., Maruyama K., Oikawa H. J. Mater. Res. 13:1998;3256.
13. Witrouw A., Proost J., Roussel P., Cosemans P., Maex K. J. Mater. Res. 14:1999;1246.
14. Arzt E., Müllner P. Thin films-Stresses and mechanical properties IX. Cammarata R., Nastasi M., Busso E., Oliver W. Mater. Res. Soc. Symp. Proc. 505, Boston, MA :1998;149 Mater. Res. Soc, Warrendale, PA.
15. Legros M., Hemker K.J., Gouldstone A., Suresh S., Keller-Flaig R.-M., Arzt E. Acta Mater. 50:2002;3435.
16. M. Legros, G. Dehm, R.M. Keller-Flaig, E. Arzt, K.J. Hemker, S. Suresh, Mater. Sci. Eng. (2000).
17. Gao H., Zhang L., Baker S.P. J. Mech. Phys. Solids. 50:2002;2169.
18. Kraft O., Freund L.B., Philips R., Arzt E. MRS Bull. 27:2002;30.
19. O. Bostrom, Ph.D. Thesis, Faculté des Sciences et Techniques de Saint-Jérôme, Marseille, France, 2001, p. 155.
20. M. Legros, B. Kaouache, O. Bostrom, P. Gergaud, O. Thomas, G. Dehm, T.J. Balk, E. Arzt, to be submitted to Phil Mag. Lett.
21. Gerth D., Katzer D., Schwarzer R.A. Phys. Stat. Sol. (a). 146:1994;299.
22. Gerth D., Katzer D., Krohn M. Thin Solid Films. 208:1992;67.
23. Park M., Krause S.J., Wilson S.R. Appl. Phys. Lett. 64:1994;721.
24. Venkatraman R., Bravman J.C., Nix W.D., Davies P.W., Flinn P.A., Fraser D.B. J. Electron. Mater. 19:1990;1231.
25. Kramer S., Mayer J., Witt C., Weickenmeier A., Ruhle M. Ultramicroscopy. 81:2000;245.
26. Takatsuija H., Tsujimoto K., Kuroda K., Saka H. Thin Solid Films. 343-344:1999;461.
27. Takatsuji H., Haruta K., Tsuji S., Kuroda K., Saka H. Surf. Coat. Tech. 125:2000;167.
28. J. Turlo, Ph.D. Thesis Department of Materials Science and Engineering, Stanford University, Stanford, CA, 1992.
29. Kim D.-K., Heiland B., Nix W.D., Arzt E., Deal M.D., Plummer J.D. Thin Solid Films. 371:2000;278.
30. Gao H., Zhang L., Nix W.D., Thompson C.V., Arzt E. Acta Mater. 47:1999;2865.