Characterisation of die attach for power devices using thermal impedance measurement - practice and experiment

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 378-384

  Ludwig, Matthias ^a   Gaedke, Alexander ^a   Slattery, Orla ^a   Flannery, John ^a   O'Mathuna, Sean Cian ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING SYSTEMS; DIODES; HEAT RESISTANCE; HEAT SINKS; SPECIFIC HEAT; THERMAL VARIABLES MEASUREMENT;

BARE DIE; COOLING CURVE ANALYSIS; JUNCTION TEMPERATURE SENSING; POWER DIODE; TEST VEHICLE; THERMAL IMPEDANCE MEASUREMENT;

POWER ELECTRONICS;

EID: 0033710193     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)