-
3
-
-
0026137499
-
A new aspect of mechanical stress effects in scaled MOS devices
-
Apr.
-
A. Hamada, T. Fursawa, N. Saito, and E. Takeda, "A new aspect of mechanical stress effects in scaled MOS devices," IEEE Trans. Electron Devices, vol. 38, pp. 895-900, Apr. 1991.
-
(1991)
IEEE Trans. Electron Devices
, vol.38
, pp. 895-900
-
-
Hamada, A.1
Fursawa, T.2
Saito, N.3
Takeda, E.4
-
4
-
-
0034452586
-
Mechanical stress effect of etch-stop nitride and its impact on deep submicron transistor design
-
S. Ito, H. Namda, K. Yamaguchi, T. Hirata, K. Ando, S. Koyama, S. Kuroki, N. Ikezawa, T. Suzuki, T. Saitoh, and T. Horiuchi, "Mechanical stress effect of etch-stop nitride and its impact on deep submicron transistor design," in IEDM Tech. Dig., 2000, pp. 247-250.
-
(2000)
IEDM Tech. Dig.
, pp. 247-250
-
-
Ito, S.1
Namda, H.2
Yamaguchi, K.3
Hirata, T.4
Ando, K.5
Koyama, S.6
Kuroki, S.7
Ikezawa, N.8
Suzuki, T.9
Saitoh, T.10
Horiuchi, T.11
-
5
-
-
0030388367
-
The impact of mechanical stress control on VLSI fabrication process
-
S. Ikeda, Y. Hagiwara, H. Miura, and H. Ohta, "The impact of mechanical stress control on VLSI fabrication process," in IEDM Tech. Dig., 1996, pp. 77-80.
-
(1996)
IEDM Tech. Dig.
, pp. 77-80
-
-
Ikeda, S.1
Hagiwara, Y.2
Miura, H.3
Ohta, H.4
-
6
-
-
0031166132
-
The effect of externally imposed mechanical stress on the hot-carrier-induced degradation of deep-sub micron nMOSFET's
-
June
-
R. Degraeve, G. Groeseneken, I. D. Wolf, and H. E. Maes, "The effect of externally imposed mechanical stress on the hot-carrier-induced degradation of deep-sub micron nMOSFET's," IEEE Trans. Electron Devices, vol. 44, pp. 943-949, June 1997.
-
(1997)
IEEE Trans. Electron Devices
, vol.44
, pp. 943-949
-
-
Degraeve, R.1
Groeseneken, G.2
Wolf, I.D.3
Maes, H.E.4
-
7
-
-
0032003205
-
The effect of patterns on thermal stress during rapid thermal processing of silicon wafers
-
Mar.
-
J. P. Hebb and K. F. Jensen, "The effect of patterns on thermal stress during rapid thermal processing of silicon wafers," IEEE Trans. Semiconduct. Manuf., vol. 11, pp. 99-107, Mar. 1998.
-
(1998)
IEEE Trans. Semiconduct. Manuf.
, vol.11
, pp. 99-107
-
-
Hebb, J.P.1
Jensen, K.F.2
-
8
-
-
0028734699
-
Comprehensive RTP modeling and simulation including thermal stress analysis and feature size optical effects
-
A. V. Kolpakov, T. M. Makhviladze, A. V. Panjukhin, O. S. Volchek, and A. F. Erofeev, "Comprehensive RTP modeling and simulation including thermal stress analysis and feature size optical effects," in IEDM Tech. Dig., 1994, pp. 541-544.
-
(1994)
IEDM Tech. Dig.
, pp. 541-544
-
-
Kolpakov, A.V.1
Makhviladze, T.M.2
Panjukhin, A.V.3
Volchek, O.S.4
Erofeev, A.F.5
-
9
-
-
0033315078
-
Light emission and detection by metal oxide silicon tunneling diodes
-
C. W. Liu, M. H. Lee, C. F. Lin, I. C. Lin, W. T. Liu, and H. H. Lin, "Light emission and detection by metal oxide silicon tunneling diodes," in IEDM Tech. Dig., 1999, pp. 749-752.
-
(1999)
IEDM Tech. Dig.
, pp. 749-752
-
-
Liu, C.W.1
Lee, M.H.2
Lin, C.F.3
Lin, I.C.4
Liu, W.T.5
Lin, H.H.6
-
10
-
-
0026982481
-
A comprehensive analytical model for metal-insulator-semiconductor (MIS) devices
-
Dec.
-
M. Y. Doghish and F. D. Ho, "A comprehensive analytical model for metal-insulator-semiconductor (MIS) devices," IEEE Trans. Electron Devices, vol. 39, pp. 2771-2780, Dec. 1992.
-
(1992)
IEEE Trans. Electron Devices
, vol.39
, pp. 2771-2780
-
-
Doghish, M.Y.1
Ho, F.D.2
-
11
-
-
0035445463
-
A comprehensive study of inversion current in MOS tunneling diodes
-
Sept.
-
C. H. Lin, B. C. Hsu, M. H. Lee, and C. W. Liu, "A comprehensive study of inversion current in MOS tunneling diodes," IEEE Trans. Electron Devices, vol. 48, pp. 2125-2130, Sept. 2001.
-
(2001)
IEEE Trans. Electron Devices
, vol.48
, pp. 2125-2130
-
-
Lin, C.H.1
Hsu, B.C.2
Lee, M.H.3
Liu, C.W.4
-
12
-
-
0035803250
-
Degradation in metal-oxide-semiconductor (MOS) structure with ultrathin gate oxide due to external compressive stress
-
C. C. Hong and J. G. Hwu, "Degradation in metal-oxide-semiconductor (MOS) structure with ultrathin gate oxide due to external compressive stress," Appl. Phys. Lett., vol. 79, no. 23, pp. 3797-3799, 2001.
-
(2001)
Appl. Phys. Lett.
, vol.79
, Issue.23
, pp. 3797-3799
-
-
Hong, C.C.1
Hwu, J.G.2
-
13
-
-
0037091888
-
Enhanced thermally induced stress effect on an ultrathin gate oxide
-
J. L. Su, C. C. Hong, and J. G. Hwu, "Enhanced thermally induced stress effect on an ultrathin gate oxide," J. Appl. Phys., vol. 91, no. 8, pp. 5423-5428, 2002.
-
(2002)
J. Appl. Phys.
, vol.91
, Issue.8
, pp. 5423-5428
-
-
Su, J.L.1
Hong, C.C.2
Hwu, J.G.3
-
14
-
-
36149012552
-
Deformation potentials in nonpolar crystals
-
J. Bardeen and W. Shockley, "Deformation potentials in nonpolar crystals," Phys. Rev., vol. 80, p. 72, 1950.
-
(1950)
Phys. Rev.
, vol.80
, pp. 72
-
-
Bardeen, J.1
Shockley, W.2
-
15
-
-
0030406642
-
The influence of process-induced stress on device characteristics and its impact on scaled device performance
-
P. Smeys, P. B. Griffin, Z. U. Rek, I. D. Wolf, and K. C. Saraswat, "The influence of process-induced stress on device characteristics and its impact on scaled device performance," in IEDM Tech. Dig., 1996, pp. 709-712.
-
(1996)
IEDM Tech. Dig.
, pp. 709-712
-
-
Smeys, P.1
Griffin, P.B.2
Rek, Z.U.3
Wolf, I.D.4
Saraswat, K.C.5
-
16
-
-
0032636441
-
Stress induced defects and transistor leakage for shallow trench isolated SOI
-
May
-
J. W. Sleight, C. Lin, and G. J. Grula, "Stress induced defects and transistor leakage for shallow trench isolated SOI," IEEE Eletron Device Lett., vol. 20, pp. 248-250, May 1999.
-
(1999)
IEEE Eletron Device Lett.
, vol.20
, pp. 248-250
-
-
Sleight, J.W.1
Lin, C.2
Grula, G.J.3
-
17
-
-
33745905893
-
Stress-related problems in silicon technology
-
S. M. Hu, "Stress-related problems in silicon technology," J. Appl. Phys., vol. 70, no. 6, pp. R53-R80, 1991.
-
(1991)
J. Appl. Phys.
, vol.70
, Issue.6
-
-
Hu, S.M.1
-
18
-
-
0021517521
-
Defects introduced in silicon wafers during isothermal annealing: Thermalelastic and thermalplastic effects
-
G. Mentini, L. Correra, and C. Donolato, "Defects introduced in silicon wafers during isothermal annealing: thermalelastic and thermalplastic effects," J. Appl. Phys., vol. 56, no. 10, pp. 2922-2929, 1984.
-
(1984)
J. Appl. Phys.
, vol.56
, Issue.10
, pp. 2922-2929
-
-
Mentini, G.1
Correra, L.2
Donolato, C.3
-
19
-
-
0024765999
-
Process uniformity and slip dislocation patterns in linearly ramped-temperature transient rapid thermal processing of silicon
-
Dec.
-
M. M. Moslehi, "Process uniformity and slip dislocation patterns in linearly ramped-temperature transient rapid thermal processing of silicon," IEEE Trans. Semiconduct. Manufact., vol. 2, pp. 130-140, Dec. 1989.
-
(1989)
IEEE Trans. Semiconduct. Manufact.
, vol.2
, pp. 130-140
-
-
Moslehi, M.M.1
-
20
-
-
36449002580
-
Two-dimensional state of stress in a silicon wafer
-
H. Liang, Y. Pan, S. Zhao, G. Qin, and K. K. Chin, "Two-dimensional state of stress in a silicon wafer," J. Appl. Phys., vol. 71, no. 6, pp. 2863-2870, 1992.
-
(1992)
J. Appl. Phys.
, vol.71
, Issue.6
, pp. 2863-2870
-
-
Liang, H.1
Pan, Y.2
Zhao, S.3
Qin, G.4
Chin, K.K.5
-
21
-
-
0000481654
-
Influence of oxide thickness nonuniformities on the tunneling current-voltage and capacitance-voltage characteristics of metal-oxide-semiconductor system
-
B. Majkusiak and A. Strojwas, "Influence of oxide thickness nonuniformities on the tunneling current-voltage and capacitance-voltage characteristics of metal-oxide-semiconductor system," J. Appl. Phys., vol. 74, no. 9, pp. 5638-5647, 1993.
-
(1993)
J. Appl. Phys.
, vol.74
, Issue.9
, pp. 5638-5647
-
-
Majkusiak, B.1
Strojwas, A.2
-
22
-
-
0020163706
-
On tunneling in metal-oxide-silicon structures
-
Z. A. Weinberg, "On tunneling in metal-oxide-silicon structures," J. Appl. Phys., vol. 53, no. 7, pp. 5052-5056, 1982.
-
(1982)
J. Appl. Phys.
, vol.53
, Issue.7
, pp. 5052-5056
-
-
Weinberg, Z.A.1
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