Life assessment of solder joint

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1471-1477

  Shiratori, Masaki ^a   Yu, Qiang ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0007905811     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)

1. Busso, E. P., Kitano, M., and Kumazawa, T., 1994, "Modeling Complex Inelastic Deformation Processes in IC Packages' Solder Joints," ASME Journal of Electronic Packaging, Vol. 116, 6-15.
2. Dasgupta, A. , Oyan, C., Barker, D., and Pecht, M., 1992,"Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach," ASME Journal of Eletronic Packaging, Vol.114, 152-160.
3. Engelmaier, W., 1984, "Functional Cycles and Surface Mounting Attachment Reliability," ISHM Technical Monogragh Series 6984-002, ISHM, Silver Spring, MD, 87-114.
4. Lau, J. H. and Rice, D. W., 1985, "Solder Joint Fatigue in Surface Mount Technology: State of the Art," Solid State Technology, October, 91-140.
5. Lau, J. H. and Rice, D. W., and Erasmus, S., 1992, "Thermal Fatigue Life of 256-Pin, 0.4mm pitch Plastic Quad Flat Pack(QFP) Solder Joint," ASME Advances in Electronic Packaging 1992.
6. Manson, S. S., Halford, G. R., and Hirschberg, M. H., 1971, "Creep-Fatigue Analysis by Strain-Range Partitioning," ASME Symposium on "Design for Elevated Temp-Environment", San Francisco, CA.
7. Mukai, M., Kawakami, T., Endo, T., and Takahashi, K., 1991, "Elastic-Creep Behavior and Fatigue Life in an IC Package Solder Joint," in Proc. 4th Annual Meeting on Computational Mechanics, JSME, No. 910-79, 223-224.
8. Pan, T-Y, 1991, "Thermal Cycling Induced Plastic Deformation in Solder Joints - Part1 : Accumulated Deformation in Surface Mount Joints," ASME Journal of Electronic Packaging, Vol. 113, 8-15.
9. Pao, Y. -H., Badgley, S., Jih, E., Govila, R., 1993, "Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints," ASME Journal of Electronic Packaging, Vol. 115, 147-152.
10. Paydar, N., Tong, Y., Akay, H.U., 1994, "A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints," ASME Journal of Electronic Packaging, Vol. 116, 265-273.
11. Sandor, B.i., "Life Preicition of Solder Joints: Engineering Mechanics Methods," Solder Mechanics - A State of the Art Assessment, 363-419.
12. Sarihan V., 1993, "Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling," ASME Journal of Electronic Packaging, Vol. 115, 16-22.
13. Shratori, M. Yu, Q., and Nishijima, A., 1993, "Analysis of Stress Intensity Factors and Probabilistic Fatigue Life Assessment for Surface Cracks in Flip Chip Solder Joints," ASME Advances in Electronic Packaging 1993, 487-492.
14. Shiratori, M. Yu, Q., and Wang, S., 1995, "A Computational and Experimental Hybrid Approach to Creep Fatigue Behavior of Surface-Mounted Sodler Joints", ASME Advances in Electronic Packaging 1995, EEP-Vol. 10-1, 451-457.
15. Solomon, H. D., 1990, "High and Low Temperature Strain-Life Behavior of a Pb Rich Solder," ASME Journal of Electronic Packaging, Vol. 112, 123-128.
16. Vaynman, S., 1990, "Effect of Temperature on Isothermal Fatigue of Solders," IEEE Transactions on Components, hybrids, and Manufacturing Technology, Vol. 13, No.4.
17. Verma, S., Dasgupta, A., and Barker, D., 1993, "A Numerical Staudy of Fatigue Life of J-Leaded Sodler Joints Using the Energy Partitioning Approach," ASME Journal of Electronic Packaging, Vol. 115, 416-423.