Investigating the thermal response of a micro-optical shutter

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 324-331

  Wong, Chung Nin Channy ^a   Graham, Samuel ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Contact resistance; MOEMS; Thermal conduction; Thermal management

Indexed keywords

ELECTRIC CONTACTS; ELECTRIC RESISTANCE; ELECTRONS; HEATING; INTEGRATED CIRCUIT MANUFACTURE; OPTICAL SHUTTERS; PHOTONS; SEMICONDUCTOR LASERS; SOLID STATE LASERS; SPECIFIC HEAT; THERMAL CONDUCTIVITY;

CONTACT RESISTANCE; MICRO-OPTICAL SHUTTER; THERMAL MANAGEMENT; THERMAL RESPONSE; THREE-DIMENSIONAL SOLID GEOMETRY; TWO-DIMENSIONAL MASK LAYOUT;

MICROELECTROMECHANICAL DEVICES;

EID: 0041885419     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815095     Document Type: Article

References (18)

1. M. S. Rodgers and J. J. Sniegowski, "Designing microelectro-mechanical systems-on-a-Chip in a 5-Level surface micromachine technology," in Proc., 2nd Int. Conf. Eng. Design Automat., Maui, HI, 1998.
2. Autodesk. (2003) AutoCAD by Autodesk. Online. Available: http://www.autocad.com
3. V. R. Yarberry and C. R. Jorgensen, "A 2D visualization tool for SUMMiT™ V design," in Proc. 4th Int. Conf. Modeling Simulation Microsyst., Hilton Head, SC, 2001, pp. 606-609.
4. C. R. Jorgensen and V. R. Yarberry, "A 3D geometry modeler for the SUMMiT™ V MEMS designer," in Proc. 4th Int. Conf. Modeling Simulation Microsyst., Hilton Head, SC, 2001, pp. 594-597.
5. J. F. Shepherd et al., "CUBIT mesh generation toolkit," Tech. Rep., Sandia Nat. Lab., Albuquerque, NM, SAND2000-2647, 2000.
6. D. K. Gartling, R. E. Hogan, and M. W. Glass, "COYOTE-A finite element computer program for nonlinear heat conduction problems," Tech. Rep., Sandia Nat. Labs, Albuquerque, NM, SAND94-1173, 1994.
7. W. C. Mills-Curran, A. P. Gilkey, and D. P. Flanagan, "EXODUS: A finite element file format for pre- and postprocessing," Sandia Nat. Labs. Albuquerque, NM, SAND87-2997, 1987.
8. (2002) ACIS by Spatial Corporation, Tech. Rep., USA. Online. Available: http://www.spatial.com
9. J. Z. Byrne, C. C. Liu, and D. Brady, "Optical properties of micromachined polysilicon reflective surfaces with etching holes," Proc. SPIE, vol. 3511, pp. 307-14, 1998.
10. X. Xu, C. P. Grigoropoulos, and R. E. Russo, "Transient temperature during pulsed excimer laser heating of thin polysilicon films obtained by optical reflectivity measurement," Trans. ASME J. Heat Transfer, vol. 117, no. 1, pp. 17-14, Feb. 1995.
11. Y. Laghla, E. Scheid, H. Vergnes, and J. P. Couderc, "Electronic properties and microstructure of undoped, and B- or P-doped polysilicon deposited by LPCVD," Solar Energy Mater. Solar Cells, vol. 48, no. 1-4, pp. 303-314, Nov. 1997.
12. X. Xu and C. P. Grigoropoulos, "High temperature radiative properties of thin polysilicon films at the λ = 0.6328 μm wavelength," Int. J. Heat Mass Transfer, vol. 36, no. 17, pp. 4163-4172, 1993.
13. D. P. H. Hasselman and L. E. Johnson, "Effective thermal conductivity of composites with interfacial thermal barrier resistance," J. Composite Mater., vol. 21, pp. 508-515, 1987.
14. S. Graham, "The effective thermal conductivity of damaged composites," Ph.D. dissertation, Georgia Inst. Technol., Atlanta, 1999.
15. A. D. McConnell, U. Srinivasan, and K. E. Goodson, "Thermal conductivity of doped polysilicon layers," J. Microelectromech. Syst., vol. 10, no. 3, pp. 360-369, Sept. 2001.
16. S. Uma, A. D. McConnell, M. Asheghi, K. Kurabayashi, and K. E. Goodson, "Temperature dependent thermal conductivity of undoped polycrystalline silicon layers," in Proc. 14th Symp. Thermophys. Properties, June 25-30, 2000.
17. M. v. Arx, O. Paul, and H. Baltes, "Process-Dependent thin-film thermal conductivities for thermal CMOS MEMS," J. Microelectromech. Syst., vol. 9, no. 1, pp. 136-145, Mar. 2000.
18. F. Völklein and H. Baltes, "A microstructure for measurement of thermal conductivity of polysilicon thin films," J. Microelectromech. Syst., vol. 1, no. 4, pp. 193-196, Dec. 1992.