Development of new no-flow underfill materials for both eutectic Sn-Pb solder and a high temperature melting lead-free solder

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 466-472

  Li, Haiying ^a   Johnson, Ashanti ^a,b   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b MOREHOUSE COLLEGE   (United States)

Author keywords

Electronic packaging; Epoxy; Eutectic Sn Pb; Flip chip; Fluxing agent; Lead free; No flow; Solder; Underfill

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; EUTECTICS; GLASS TRANSITION; KINETIC THEORY; MELTING; RHEOMETERS; SOLDERING ALLOYS; TEMPERATURE; THERMAL EXPANSION; TIN ALLOYS;

CURING KINETICS; FLUXING AGENT; LEAD FREE SOLDER; THERMOMECHANICAL ANALYSIS; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0041885407     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815094     Document Type: Article

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