Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 141-151

  Shi, S H ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSTS; CURING; FLUXES; SOLDERING;

FLUXING AGENTS;

FLIP CHIP DEVICES;

EID: 0033338701     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774718     Document Type: Article

References (8)

1. C. P. Wong, S. H. Shi, and G. Jefferson, "High performance no-flow underfills for low-cost flip-chip applications," in Proc. 47th ECTC, San Jose, CA, May 18-21, 1997, pp. 850-858.
2. L. Nguyen, L. Hoang, P. Fine, S. H. Shi, M. Vincent, L. Wang, C. P. Wong, Q. Tong, B. Ma, R. Humphreys, and A. Savoca, "High performance underfills development-Materials, processes, and reliability," in Proc. PEP'97, Norrköping, Sweden, Oct. 1997, pp. 300-306.
3. C. P. Wong and S. H. Shi, "Low-cost high-performance no-flow underfills for flip-chip applications," U.S. patent pending, Feb. 1998.
4. M. A. Capote, M. G. Todd, and H. P. Craig, "Electrically conductive compositions and methods for the preparation and use thereof," U.S. Patent 5376403.
5. D. O. Powell and A. K. Trivedi, "Flip-chip on FR-4 integrated circuit packaging," in Proc. 43rd ECTC, Orlando, FL, June 1993, pp. 182.
6. Y. Tsukada, Y. Mashimoto, T. Nishio, and N. Mil, "Reliability and stress analysis of encapsulated flip chip joint on epoxy based printed circuit packaging," in Proc. 1992 Joint ASME/JSME Conf. Electron. Packag., 1992, vol. 2, p. 827.
7. K. Gilleo, "New generation underfills power the 2nd flip chip revolution," Cookson Electronics Group, Providence, RI, 1996, personal communication.
8. J. dementi, J. McCreary, T. M. Niu, J. Palomaki, J. Varcoe, and G. Hill, "Flipchip encapsulation on ceramic substrates," in Proc. 43rd ECTC, Orlando, FL, June 1993, p. 175.