Flip-chip solder bump fatigue life enhanced by polymer encapsulation

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 1990, Pages 338-344

  Suryanarayana, D ^a   Hsiao, R ^a   Gall, T P ^a   McCreary, J M ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; POLYMERS--ENCAPSULATION;

C4 JOINTS; CHIP CONNECTIONS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0025536169     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)