Thermomechanical deformation of 1 μm thick Cu-polyimide line arrays studied by scanning probe microscopy

Journal of Electronic Materials

Volumn 25, Issue 6, 1996, Pages 976-982

  Zhmurkin, D V ^a   Gross, T S ^a   Buchwalter, L P ^b   Kaufman, F B ^c  

^a Univ of New Hampshire   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c CABOT MICROELECTRONICS CORPORATION   (United States)

Author keywords

Atomic force microscope; Coefficient of thermal expansion; Interconnects; Polyimide; Thermal expansion

Indexed keywords

ARRAYS; ATOMIC FORCE MICROSCOPY; DEFORMATION; FAILURE (MECHANICAL); MICROSCOPY; THERMAL EFFECTS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; INTERCONNECTS; INTERFACIAL FAILURES; SCANNING PROBE MICROSCOPY; THERMOMECHANICAL DEFORMATION;

POLYIMIDES;

EID: 0030156788     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02666733     Document Type: Article

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