Integrated MEMS technologies

MRS Bulletin

Volumn 26, Issue 4, 2001, Pages 291-295

  Franke, Andrea E ^a   King, Tsu Jae ^a   Howe, Roger T ^a  

^a NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039784133     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2001.62     Document Type: Article

References (19)

1. J.H. Smith, S. Montague, J.J. Sniegowski, J.R. Murray, and P.J. McWhorter, "Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS," Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1995) p. 609.
2. J.T. Kung, U.S. Patent No. 5,504,026 (April 2, 1996).
3. H.C. Nathanson, W.E. Newell, R.A. Wickstrom, and J.R. Davis Jr., IEEE Trans. Electron Devices ED-14 (1967) p. 117.
4. R.T. Howe and R.S. Muller, "Integrated Resonant-Microbridge Vapor Sensor," Proc. IEEE IEDM 1984 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1984) p. 213.
5. T.A. Core, W.K. Tsang, and S.J. Sherman, Solid State Technol. 36 (10) (1993) p. 39.
6. M. Offenberg, F. Lamer, B. Elsner, H. Munzel, and W. Riethmuller, in Tech. Digest 8th Int. Conf. on Solid-State Sensors and Actuators/Eurosensors IX, Vol. 1 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1995) p. 589.
7. T.J. Brosnihan, J.M. Bustillo, A.P. Pisano, and R.T. Howe, "Embedded Interconnect and Electrical Isolation for High-Aspect-Ratio, SOI Inertial Instruments," Tech. Digest 1997 Int. Conf. on Solid-State Sensors and Actuators (Transducers '97), Vol. 1 (1997) p. 637.
8. L. Parameswaran, C. Hsu, and M.A. Schmidt, "A Merged MEMS-CMOS Process Using Silicon Wafer Bonding," Proc. IEDM 1995 (Institute of Electrical and Electronics Engineers, Piscataway, NJ) p. 613.
9. H. Baltes and O. Brand, IEEE AES Sys. Mag. 14 (1999) p. 29.
10. H. Xie, L. Erdmann, X. Zhu, K. Gabriel, and G. Fedder, "Post-CMOS Processing for High-Aspect-Ratio Integrated Silicon Microstructures," Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p. 77.
11. K.A. Shaw and N.C. MacDonald, in Proc. IEEE 9th Int. Workshop on MEMS (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1996) p. 44.
12. P.F. Van Kessel, L.J. Hornbeck, R.E. Meier, and M.R. Douglass, in Proc. IEEE 86 (1998) p. 1687.
13. M.W. Putty and K. Najafi, "A Micromachined Vibrating Ring Gyroscope," Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1994), p. 213.
14. M.S. Rodgers and J.J. Sniegowski, "5-Level Polysilicon Surface Micromachine Technology: Application to Complex Mechanical Systems," Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 1998) p. 144.
15. S. Sedky, P. Fiorini, M. Caymax, S. Loreti, K. Baert, L. Hermans, and R. Mertens, IEEE/ASME J. MEMS 7 (1998) p. 365.
16. B. Li, B. Xiong, L. Jiang, Y. Zohar, and M. Wong, IEEE/ASME J. MEMS 8 (1999) p. 366.
17. A.E. Franke, D. Bilic, D.T. Chang, P.T. Jones, T.-J. King, R.T. Howe, and G.C. Johnson, Tech. Digest IEEE Int. MEMS '99 Conference (Institute of Electrical and Electronics Engineers, Piscataway NJ, 1999) p. 630.
18. A.E. Franke, Y. Jiao, M.T. Wu, T.-J. King, and R.T. Howe, "Post-CMOS Modular Integration of Poly-SiGe Microstructures Using Poly-Ge Sacrificial Layers," Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p. 18.
19. J.M. Heck, C.G. Keller, A.E. Franke, L. Muller, T-J. King, and R.T. Howe, in Proc. 10th Int. Conf. on Solid-State Sensors and Actuators (Transducers '99), Vol. 1 (Institute of Electrical Engineers of Japan, Sendai, 1999) p. 328.