Structural and mechanical properties of polycrystalline silicon germanium for micromachining applications

Journal of Microelectromechanical Systems

Volumn 7, Issue 4, 1998, Pages 365-372

  Sedky, Sherif ^b,d,e,f   Fiorini, Paolo ^b,c,e,g,h,i   Caymax, Matty ^b,c,e,i   Loreti, Stefano ^c,f,h   Baert, Kris ^b,e,i,j   Hermans, Lou ^b,e,i,k,l   Mertens, Robert ^{a,b,e,f,i,m,n}  

^a IEEE

^b IMEC   (Belgium)

^c ROMA TRE UNIVERSITY   (Italy)

^d ENEA CR Portici   (Italy)

^e CAIRO UNIVERSITY   (Egypt)

^f UNIVERSITY OF LEUVEN   (Belgium)

^g CAIRO UNIVERSITY   (Egypt)

^h SAPIENZA UNIVERSITY OF ROME   (Italy)

ⁱ IBM RESEARCH   (United States)

^j Ital Natl Agy New Technol E   (Italy)

^k MITSUBISHI ELECTRIC CORPORATION   (Japan)

^l Microsystems Group   (Japan)

^m Microsystems Department

ⁿ Natl Found Sci Res of Belgium   (Belgium)

more..

Author keywords

Bolometers; Poly SiGe; Stress; Surface micromachining

Indexed keywords

ANNEALING; BOLOMETERS; CHEMICAL VAPOR DEPOSITION; MICROMACHINING; POLYCRYSTALLINE MATERIALS; POLYMERIC MEMBRANES; THERMAL STRESS; TRANSMISSION ELECTRON MICROSCOPY; X RAY CRYSTALLOGRAPHY;

POLYCRYSTALLINE SILICON GERMANIUM;

MICROELECTROMECHANICAL DEVICES;

EID: 0032300714     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.735343     Document Type: Article

References (14)

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