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Volumn , Issue , 1999, Pages 133-141
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Optimizing cost and thermal performance: Rapid prototyping of a high pin count cavity-up enhanced plastic ball grid array (EPBGA) package
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER SIMULATION;
COMPUTER SOFTWARE;
COSTS;
ELECTRONICS PACKAGING;
FINITE ELEMENT METHOD;
HEAT RESISTANCE;
MATHEMATICAL MODELS;
SENSITIVITY ANALYSIS;
STANDARDS;
ENHANCED PLASTIC BALL GRID ARRAYS (EPBGA);
SOFTWARE PACKAGE ANSYS;
ULSI CIRCUITS;
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EID: 0032678602
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (7)
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References (30)
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