Investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 364-1, Issue , 1999, Pages 21-28

  Lee, Tien Yu Tom ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FLOW OF FLUIDS; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; MATHEMATICAL MODELS; SURFACES;

FLIP CHIP PLASTIC BALL GRID ARRAY PACKAGE; QUAD FLAT PACKAGE; THERMAL ASSESSMENT;

THERMODYNAMICS;

EID: 0033325294     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Flotherm Reference Manual, 1994, Flomerics Limited, V. 1.4, Document No. Flotherm/RM/0394/1/0.
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3. Hwang, C. B., 1999, "Thermal Design for Flip Chip on Board in Natural Convection," Proceedings of the 15th Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), pp. 125-132.
4. Johnson, Z. and Eyman, M., 1998, "Designed Based Thermal Simulation Methodology for Ball Grid Array Packages," Proceedings of the 6th Intersociety Conference on Thermal Phenomena in Electronic Systems (ITHERM), pp. 82-87.
5. Johnson, Z., Ramakrishna, K., Joiner, B., and Eyman, M., 1997, "Thermal Sub-Modeling of the Wire-Bonded Plastic Ball Grid Array Package," Proceedings of the 13th Semiconductor Thermal Measurement and Management Symposium (Semi-Therm), pp. 1-9.
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7. Lee, T.Y. and Mahalingam, M., 1997, "Thermal Limits of Flip Chip Package-Experimental Validated, CFD Supported Case Studies," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol. 20, No. 1, pp. 94-103.
8. Mulgaonker, S., Chambers, B., and Mahalingam, M., 1995, "An Assessment of the Thermal Performance of the PBGA Family," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No. 4, pp. 739-748.
9. Sathe, S. B. and Sammakia, B. G., 1996, "A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package," ASME Heat Transfer Development, Vol. 329, pp. 83-93.
10. Sathe, S. B. and Sammakia, B. G., 1998, "Interaction of the System and Module-Level Thermal Phenomena-a Flip-Chip/BGA Example," Electronics Cooling Magazine, Vol. 4, No. 2, May, pp. 14-22.